Infineon FF1800R17IP5: A High-Performance 1800A/1700V Dual IGBT Module for Industrial Drives and Power Conversion
The relentless pursuit of higher power density, greater efficiency, and enhanced reliability in industrial applications drives the continuous innovation in power semiconductor technology. At the forefront of this evolution is the Infineon FF1800R17IP5, a robust dual IGBT module engineered to meet the demanding requirements of modern high-power industrial systems. This module is not merely a component; it is a comprehensive power solution designed to excel in environments such as industrial motor drives, heavy-duty converters, and renewable energy power conversion systems.
Engineered for Extreme Performance
The defining characteristics of the FF1800R17IP5 are its impressive 1800 Ampere continuous current rating and a 1700 Volt blocking voltage capability. This combination of high current and high voltage makes it an ideal candidate for the heart of multi-megawatt drive systems, large uninterruptible power supplies (UPS), and industrial welding equipment. The module integrates two IGBTs in a single housing, providing a compact and highly integrated solution that simplifies power stage design and reduces the overall system footprint.
Advanced Technology for Superior Efficiency
At the core of its performance is Infineon's advanced IGBT7 chip technology. This latest generation of IGBTs offers a significantly improved trade-off between conduction losses and switching losses. The result is a remarkable reduction in total power losses, which directly translates into higher system efficiency, lower operating temperatures, and the potential for increased switching frequencies. This allows designers to either shrink the size of cooling systems or push the power output of their existing designs further.
Enhanced Robustness and Reliability
Industrial environments are notoriously harsh, with wide temperature fluctuations and demanding load cycles. The FF1800R17IP5 is built to withstand these challenges. Key features that ensure long-term reliability include:
Low thermal resistance and high cycling capability for extended lifetime under temperature swings.
An aluminum silicon carbide (AlSiC) baseplate that provides excellent thermal performance and matches the coefficient of thermal expansion (CTE) of the semiconductor chips, minimizing mechanical stress.
PressFIT contact technology for a solder-free, robust, and gas-tight connection to the PCB, enhancing manufacturing yield and operational reliability.
Optimized for System Integration
The module is designed with the system architect in mind. Its low-indunce package design minimizes parasitic effects, which is crucial for managing voltage overshoot during high-speed switching events. This inherent design quality simplifies snubber circuit requirements and contributes to stable and predictable switching behavior. Furthermore, the integrated NTC temperature sensor provides a critical feedback signal for the system's thermal management control, enabling proactive cooling and overload protection.
ICGOOODFIND
The Infineon FF1800R17IP5 stands as a pinnacle of power module engineering, offering an unparalleled blend of ultra-high power handling, cutting-edge efficiency from IGBT7 technology, and exceptional ruggedness. It empowers engineers to push the boundaries of performance in high-power industrial and energy conversion applications, setting a new benchmark for reliability and power density.
Keywords:
1. IGBT7 Technology
2. High Power Density
3. Industrial Drives
4. Thermal Performance
5. PressFIT Technology
